Product Application:

This machine is suitable for double-sided precision grinding of silicon wafers, quartz wafers, ceramic wafers, gallium arsenide wafers, and other hard and brittle materials.

Main Features:

1. Inverter combined with asynchronous motor drive achieves soft start, soft stop, stable speed regulation, and low impact.

2. Dual-motor synchronous drive provides a wider speed range for the sun gear, adapting to different grinding process requirements.

3. Synchronous lifting of the sun gear and internal gear ring meets the requirements for loading/unloading workpieces and adjusting the idler gear engagement position.

4. The upper and lower grinding discs adopt helical gear transmission, improving operational stability.

5. PLC control system with electro-pneumatic proportional valve closed-loop feedback control for pressure enables more convenient and precise pressure level setting, simple operation, and reliable and stable performance.

6. The human-machine interface (HMI) terminal (NT) is used for display and PLC control, displaying operating parameters on one hand and allowing adjustment of various process parameters via touch keys on the other. Main operations are performed using conventional buttons.

7. The design and internal structure fully consider reliability, practicality, interchangeability, and ease of operation and maintenance.

Product Application:

This machine is suitable for double-sided precision grinding of silicon wafers, quartz wafers, ceramic wafers, gallium arsenide wafers, and other hard and brittle materials.

Main Technical Parameters:

1. Grinding disc size: φ1112mm × φ380mm × 50mm

2. Planetary carrier parameters: Metric M=2Z=212

Imperial DP12Z=200

3. Number of planetary carriers: 5 pieces

4. Maximum grinding diameter: φ350mm

5. Minimum grinding thickness: 0.40mm/φ125mm

6. Maximum grinding thickness: 30mm

7. Lower grinding disc speed: 0-50rpm

8. Main motor: 11kW AC380V 1450rpm variable frequency speed regulation

9. Auxiliary motor: 1.5kW AC380V 1400rpm

10. Sand pump parameters: 1/4HP 380V

11. Air source: 0.5-0.6MPa

12. Overall dimensions: 2200mm × 1600mm × 2700mm

13. Weight: Approx. 5600Kg

Machine Accuracy:

1. Lower grinding disc end runout: 0.06mm

2. Grinding disc flatness: 0.025mm

3. Sun gear radial runout: 0.08mm

4. Gear ring radial runout: 0.15mm

Processing Accuracy (After Four Dressing Wheel Repairs):

1. Parallel flatness after dressing wheel repair: ≤0.004mm

2. Workpiece surface parallelism: ≤0.0035/φ125mm

Processing Capacity:

1. Single carrier wafer capacity: 17 pieces/φ75mm, 8 pieces/φ100mm, 5 pieces/φ125mm

2. Full disc wafer capacity: 85 pieces/φ75mm, 40 pieces/φ100mm, 25 pieces/φ125mm